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  • VSC8582XKS-14

VSC8582XKS-14

256 TerminationsTelecom device1 Circuits


  • Manufacturer: Microchip Technology
  • Origchip NO: 536-VSC8582XKS-14
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 251
  • Description: 256 TerminationsTelecom device1 Circuits(Kg)

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FedEx International, 5-7 business days.

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Details

Tags

Parameters
Factory Lead Time 7 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Operating Temperature -40°C~125°C
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 256
Voltage - Supply 1V
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 1V
Reach Compliance Code unknown
JESD-30 Code S-PBGA-B256
Function Ethernet
Interface GMII, SerDes, SPI, TBI
Number of Circuits 1
RoHS Status ROHS3 Compliant

VSC8582XKS-14 Overview


Space is saved on the board by using the 256-BGA package.A Tray-packing method is used to pack telecommunications equipment.In this case, Surface Mount is the mounting type.1 circuits make up this telecom IC .When the voltage for 1V is provided, improved efficiency can be achieved.A temperature setting of -40°C~125°C ensures reliable performance.In telecom switching configuration, there are 256 terminations.1V is its supply voltage.

VSC8582XKS-14 Features


Available in the 256-BGA package

VSC8582XKS-14 Applications


There are a lot of Microchip Technology VSC8582XKS-14 Telecom applications.

  • Digital subscriber line access multiplexer (DSLAM)
  • E2 Rates PCM Line Interface
  • T1/E1/J1 Multiplexer and Channel Banks
  • Integrated Access Devices
  • T1/E1/J1 Performance Monitoring
  • ISDN terminal adapter
  • T3 channelized access concentrators
  • T2 Rates PCM Line Interface
  • Dual battery supply voltage SLICs
  • PBX (Private Branch Exchange)