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Xilinx Inc.(2351)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | REACH SVHC | Reach Compliance Code | Density | Frequency | Height | Width | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | Manufacturer Package Identifier | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Ambient Temperature Range High | Supplier Device Package | Core Architecture | Speed | Output Characteristics | Max Junction Temperature (Tj) | Memory Size | Memory Type | Core Processor | RAM Size | Number of I/O | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Boundary Scan | Data Bus Width | Bus Compatibility | Architecture | uPs/uCs/Peripheral ICs Type | Peripherals | Parallel/Serial | Clock Frequency | RAM (words) | Standby Current-Max | Access Time (Max) | UV Erasable | Programmable Type | Data Retention Time-Min | Endurance | I/O Type | Primary Attributes | Speed Grade | Connectivity |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XCF32PVOG48C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Surface Mount | Tray | 1999 | yes | Active | 3 (168 Hours) | 48 | 3A991.B.1 | 1.8V | 12.1mm | ROHS3 Compliant | Lead Free | No | 48 | 48-TFSOP (0.724, 18.40mm Width) | 1mm | 18.5mm | Surface Mount | -40°C~85°C | CMOS | 8542.32.00.61 | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 1.8V | 30 | XCF*P | 48 | 0.5mm | 1.65V | Flash Memories | 2V | 32Mb | 0.04mA | 1.65V~2V | 32MX1 | 33554432 bit | CONFIGURATION MEMORY | SERIAL | 0.001A | In System Programmable | 20 | 20000 Write/Erase Cycles | ||||||||||||||||||||||||||||||||||||||||||||||
| XCF02SVO20C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Surface Mount | Tube | 1999 | no | Active | 3 (168 Hours) | 20 | EAR99 | 3.3V | 6.5024mm | Non-RoHS Compliant | Contains Lead | Lead, Tin | No | 20 | 20-TSSOP (0.173, 4.40mm Width) | 4.4mm | Surface Mount | -40°C~85°C | CMOS | 1.19mm | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | GULL WING | 225 | 3.3V | 30 | XCF*S | 20 | 0.65mm | 3V | Flash Memories | 3.6V | 2Mb | 0.01mA | 3V~3.6V | 2MX1 | 1 | CONFIGURATION MEMORY | SERIAL | 0.001A | In System Programmable | 20 | |||||||||||||||||||||||||||||||||||||||||||||||
| XCF02SVOG20C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Surface Mount | Tube | 1999 | yes | Active | 3 (168 Hours) | 20 | EAR99 | 3.3V | 6.5mm | ROHS3 Compliant | Lead Free | 20 | 20-TSSOP (0.173, 4.40mm Width) | Parallel | Unknown | 50MHz | 1.19mm | 4.39mm | Surface Mount | -40°C~85°C | CMOS | SYNCHRONOUS | XCF02SVOG20C | 8542.32.00.51 | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 3.3V | 30 | XCF*S | 20 | 0.65mm | 3V | Not Qualified | 3.6V | 85°C | 125°C | 2Mb | FLASH | 0.01mA | 3V~3.6V | 2MX1 | SERIAL | 0.001A | In System Programmable | 20 | ||||||||||||||||||||||||||||||||||||||||||
| XC18V01VQ44C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 1999 | no | Active | 3 (168 Hours) | 44 | EAR99 | 3.3V | 10mm | Non-RoHS Compliant | Contains Lead | No | 44 | 44-TQFP | 1 Mb | 10mm | Surface Mount | 0°C~70°C | CMOS | 1.2mm | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 30 | XC18V01 | 44 | YES | 0.8mm | 3V | Flash Memories | 3.6V | 0.025mA | 3V~3.6V | 128KX8 | 8 | CONFIGURATION MEMORY | PARALLEL/SERIAL | 33MHz | 0.01A | 15 ns | In System Programmable | 20 | 20000 Write/Erase Cycles | |||||||||||||||||||||||||||||||||||||||||||||
| XC18V256PC20C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | 1999 | Obsolete | 3 (168 Hours) | 20 | 3A991.B.1.A | 3.3V | 8.9662mm | Non-RoHS Compliant | Contains Lead | No | 20 | 20-LCC (J-Lead) | 256 kb | 8.9662mm | Surface Mount | 0°C~70°C | CMOS | 4.572mm | 8542.39.00.01 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 3.3V | XC18V256 | 20 | YES | 1.27mm | 3V | Flash Memories | 3.6V | 256Kb | 0.025mA | 3V~3.6V | 32KX8 | 8 | CONFIGURATION MEMORY | PARALLEL/SERIAL | 33MHz | 0.01A | 15 ns | In System Programmable | 10 | 10000 Write/Erase Cycles | |||||||||||||||||||||||||||||||||||||||||||||||
| XC18V01VQ44I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 1998 | Obsolete | 3 (168 Hours) | 44 | 3A001.B.1.A | 3.3V | 10mm | Non-RoHS Compliant | Contains Lead | No | 44 | 44-TQFP | 1 Mb | 10mm | Surface Mount | -40°C~85°C | CMOS | 1.2mm | 8542.39.00.01 | 1 | e0 | TIN LEAD | QUAD | GULL WING | 225 | 3.3V | 30 | XC18V01 | 44 | YES | 0.8mm | 3V | Flash Memories | 3.6V | 0.025mA | 3V~3.6V | 128KX8 | 8 | CONFIGURATION MEMORY | PARALLEL/SERIAL | 33MHz | 0.01A | 15 ns | In System Programmable | 10 | 10000 Write/Erase Cycles | ||||||||||||||||||||||||||||||||||||||||||||||
| XC18V02PC44I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | 1998 | Obsolete | 3 (168 Hours) | 44 | 3A001.B.1.A | 3.3V | 16.5862mm | Non-RoHS Compliant | Contains Lead | No | 44 | 44-LCC (J-Lead) | 2 Mb | 16.5862mm | Surface Mount | -40°C~85°C | CMOS | 4.572mm | 8542.39.00.01 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 30 | XC18V02 | 44 | YES | 1.27mm | 3V | Flash Memories | 3.6V | 0.025mA | 3V~3.6V | 256KX8 | 8 | CONFIGURATION MEMORY | PARALLEL/SERIAL | 33MHz | 0.01A | 20 ns | In System Programmable | 10 | 10000 Write/Erase Cycles | ||||||||||||||||||||||||||||||||||||||||||||||
| XC18V512PC20I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | 1999 | Obsolete | 3 (168 Hours) | 20 | 3A991.B.1.A | 3.3V | 8.9662mm | Non-RoHS Compliant | Contains Lead | No | 20 | 20-LCC (J-Lead) | 512 kb | 8.9662mm | Surface Mount | -40°C~85°C | CMOS | 4.572mm | 8542.39.00.01 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 3.3V | XC18V512 | 20 | YES | 1.27mm | 3V | Flash Memories | 3.6V | 0.025mA | 3V~3.6V | 64KX8 | 8 | CONFIGURATION MEMORY | PARALLEL/SERIAL | 33MHz | 0.01A | 15 ns | In System Programmable | 10 | 10000 Write/Erase Cycles | ||||||||||||||||||||||||||||||||||||||||||||||||
| XC17V16VQ44I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 1998 | no | Obsolete | 3 (168 Hours) | 44 | EAR99 | 3.3V | 10mm | Non-RoHS Compliant | Contains Lead | No | 44 | 44-TQFP | 16 Mb | 10mm | Surface Mount | -40°C~85°C | CMOS | 1.2mm | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 30 | XC17V16 | 44 | YES | 0.8mm | 3V | 3.6V | 3-STATE | 0.1mA | 3V~3.6V | 2MX8 | 8 | CONFIGURATION MEMORY | PARALLEL/SERIAL | 20MHz | 0.001A | OTP | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||
| XC1765EPD8C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | 2000 | no | Obsolete | Not Applicable | 8 | EAR99 | 9.3599mm | Non-RoHS Compliant | Contains Lead | 8 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8-DIP (0.300, 7.62mm) | not_compliant | 7.62mm | Through Hole | 0°C~70°C | CMOS | SYNCHRONOUS | 4.5974mm | 1 | e0 | DUAL | 225 | 5V | 30 | XC1765E | 8 | NO | 2.54mm | 4.75V | Not Qualified | 5V | 5.25V | 3-STATE | 65kb | 0.01mA | 4.75V~5.25V | 64KX1 | 1 | 65536 bit | CONFIGURATION MEMORY | SERIAL | 10MHz | 0.00005A | OTP | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||
| XC17S30XLPD8I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | 1999 | Obsolete | Not Applicable | 8 | EAR99 | 9.3599mm | Non-RoHS Compliant | Contains Lead | 8 | 8-DIP (0.300, 7.62mm) | not_compliant | 7.62mm | Through Hole | -40°C~85°C | CMOS | SYNCHRONOUS | 4.5974mm | 1 | e0 | DUAL | 3.3V | XC17S30XL | 8 | NO | 2.54mm | 3V | Not Qualified | 3.3V | 3.6V | 3-STATE | 300kb | 0.005mA | 3V~3.6V | 1 | MEMORY CIRCUIT | 10MHz | 0.00005A | OTP | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC18V256VQ44C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 1999 | Obsolete | 3 (168 Hours) | 44 | 3A991.B.1.A | 3.3V | 10mm | Non-RoHS Compliant | Contains Lead | No | 44 | 44-TQFP | 256 kb | 10mm | Surface Mount | 0°C~70°C | CMOS | 1.2mm | 8542.39.00.01 | 1 | e0 | TIN LEAD | QUAD | GULL WING | 3.3V | XC18V256 | 44 | YES | 0.8mm | 3V | Flash Memories | 3.6V | 256Kb | 0.025mA | 3V~3.6V | 32KX8 | 8 | CONFIGURATION MEMORY | PARALLEL/SERIAL | 33MHz | 0.01A | 15 ns | In System Programmable | 10 | 10000 Write/Erase Cycles | |||||||||||||||||||||||||||||||||||||||||||||||
| XC18V512SO20I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | 1999 | no | Obsolete | 1 (Unlimited) | 20 | 3A991.B.1.A | 3.3V | 12.8mm | Non-RoHS Compliant | Contains Lead | No | 20 | 20-SOIC (0.295, 7.50mm Width) | 512 kb | 7.5mm | Surface Mount | -40°C~85°C | CMOS | 2.65mm | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | GULL WING | 225 | 3.3V | 30 | XC18V512 | 20 | YES | 1.27mm | 3V | Flash Memories | 3.6V | 0.025mA | 3V~3.6V | 64KX8 | 8 | CONFIGURATION MEMORY | PARALLEL/SERIAL | 33MHz | 0.01A | 15 ns | In System Programmable | 10 | 10000 Write/Erase Cycles | |||||||||||||||||||||||||||||||||||||||||||||
| XC17S30AVO8C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | 1999 | no | Obsolete | 1 (Unlimited) | 8 | EAR99 | 3.3V | 4.9mm | Non-RoHS Compliant | Contains Lead | No | 8 | 8-SOIC (0.154, 3.90mm Width) | 512 kb | 3.9mm | Surface Mount | 0°C~70°C | CMOS | 1.2mm | 1 | e0 | DUAL | GULL WING | 225 | 3.3V | 30 | XC17S30 | 8 | YES | 1.27mm | 3V | 3.6V | 3-STATE | 300kb | 0.005mA | 3V~3.6V | 1 | CONFIGURATION MEMORY | SERIAL | 0.00005A | OTP | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z045-2FBG676CES | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 7 Weeks | Tray | 2010 | Zynq®-7000 | Obsolete | 4 (72 Hours) | 85°C | 0°C | RoHS Compliant | 676-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 800MHz | 0°C~85°C TJ | XC7Z045 | 676-FCBGA (27x27) | ARM | 800MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | MCU, FPGA | DMA | Kintex™-7 FPGA, 350K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z020-1CLG484CES | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 2010 | Zynq®-7000 | Obsolete | 3 (168 Hours) | 85°C | 0°C | RoHS Compliant | 484-LFBGA, CSPBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | 0°C~85°C TJ | XC7Z020 | 484-CSPBGA (19x19) | ARM | 667MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | MCU, FPGA | DMA | Artix™-7 FPGA, 85K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z045-1FFG900CES | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 7 Weeks | Tray | 2010 | Zynq®-7000 | Obsolete | 4 (72 Hours) | 85°C | 0°C | RoHS Compliant | 900-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | 0°C~85°C TJ | XC7Z045 | 900-FCBGA (31x31) | ARM | 667MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | MCU, FPGA | DMA | Kintex™-7 FPGA, 350K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z045-2FFG900CES | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 2010 | Zynq®-7000 | Obsolete | 4 (72 Hours) | 85°C | 0°C | RoHS Compliant | 900-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 800MHz | 0°C~85°C TJ | XC7Z045 | 900-FCBGA (31x31) | ARM | 800MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | MCU, FPGA | DMA | Kintex™-7 FPGA, 350K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z010-3CLG225E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2010 | Zynq®-7000 | Active | 3 (168 Hours) | 225 | EAR99 | 13mm | ROHS3 Compliant | No | 225 | 225-LFBGA, CSPBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 866MHz | 0°C~100°C TJ | CMOS | 1.5mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 260 | 1V | 30 | XC7Z010 | YES | 0.8mm | 0.95V | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 86 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Artix™-7 FPGA, 28K Logic Cells | -3 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||
| XA7Z030-1FBG484Q | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | Obsolete | 4 (72 Hours) | 484 | EAR99 | 23mm | RoHS Compliant | 484-BBGA, FCBGA | not_compliant | 23mm | -40°C~125°C TJ | CMOS | 2.54mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 250 | 30 | YES | 1mm | S-PBGA-B484 | Other uPs/uCs/Peripheral ICs | Not Qualified | 11.8V | 667MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA | N | Kintex™-7 FPGA, 125K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU2EG-3SFVC784E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 25 Weeks | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | Obsolete | 4 (72 Hours) | 784 | 784-BFBGA, FCBGA | compliant | 0°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | 0.9V | YES | S-PBGA-B784 | 600MHz, 667MHz, 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 252 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU2EG-3SFVA625E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | Obsolete | 4 (72 Hours) | 625 | 625-BFBGA, FCBGA | compliant | 0°C~100°C TJ | CMOS | BOTTOM | BALL | 0.9V | YES | S-PBGA-B625 | 600MHz, 667MHz, 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 180 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z020-1CLG400CES | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 7 Weeks | Tray | 2010 | Zynq®-7000 | Obsolete | 3 (168 Hours) | 85°C | 0°C | RoHS Compliant | 400-LFBGA, CSPBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | 0°C~85°C TJ | XC7Z020 | 400-CSPBGA (17x17) | ARM | 667MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | MCU, FPGA | DMA | Artix™-7 FPGA, 85K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU5CG-2SFVC784I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 784 | ROHS3 Compliant | 784-BFBGA, FCBGA | -40°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | NOT SPECIFIED | YES | S-PBGA-B784 | 533MHz, 1.3GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 252 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU2CG-2SBVA484I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 484 | ROHS3 Compliant | 484-BFBGA, FCBGA | -40°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | NOT SPECIFIED | YES | R-PBGA-B484 | 0.876V | 533MHz, 1.3GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 82 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU9EG-2FFVC900I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ROHS3 Compliant | 900-BBGA, FCBGA | -40°C~100°C TJ | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 204 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU2EG-2SFVC784I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 784 | ROHS3 Compliant | 784-BFBGA, FCBGA | -40°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | NOT SPECIFIED | YES | R-PBGA-B784 | 0.825V | 0.876V | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 252 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU9EG-2FFVB1156E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | yes | Active | 4 (72 Hours) | ROHS3 Compliant | 1156-BBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 328 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z014S-2CLG400I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2016 | Zynq®-7000 | yes | Active | 3 (168 Hours) | 400 | 17mm | ROHS3 Compliant | 400-LFBGA, CSPBGA | 17mm | -40°C~100°C TJ | CMOS | 1.6mm | 8542.31.00.01 | e3 | Matte Tin (Sn) | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | YES | 0.8mm | S-PBGA-B400 | 0.95V | 1.05V | 766MHz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 125 | YES | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 800MHz | 256000 | Artix™-7 FPGA, 65K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU9EG-2FFVC900E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | yes | Active | 4 (72 Hours) | ROHS3 Compliant | 900-BBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 204 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |