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Microchip Technology(28120)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Min Supply Voltage | Frequency | Height | Width | Mounting Type | Weight | Operating Temperature | Size / Dimension | Technology | Operating Supply Current | Max Supply Current | Current - Supply | Height Seated (Max) | Ratings | HTS Code | Physical Dimension | Nominal Supply Current | Type | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Surface Mount | Terminal Pitch | JESD-30 Code | Subcategory | Qualification Status | Power Supplies | Max Power Dissipation | Voltage | Data Rate | Frequency Stability | Load Capacitance | Operating Frequency | Output | ESD Protection | Supplier Device Package | Rise Time-Max | Fall Time-Max | Symmetry-Max | Dual Supply Voltage | Function | USB | Voltage - Supply | Protocol | Standards | Number of Transceivers | Boundary Scan | Low Power Mode | Bus Compatibility | uPs/uCs/Peripheral ICs Type | Data Transfer Rate-Max | Clock Frequency | Number of Serial I/Os | Data Encoding/Decoding Method | Max Duty Cycle | Current - Supply (Max) | Number of Transmit Buffers | Number of Receive Buffers | Base Resonator | Current - Supply (Disable) (Max) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MX553BBB156M250 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
6 Weeks | Tube | 2017 | MX55 | Active | 3 (168 Hours) | ROHS3 Compliant | 6-LLGA | 156.25MHz | Surface Mount | -40°C~85°C | 0.197Lx0.126W 5.00mmx3.20mm | 0.055 1.40mm | 5.0mm x 3.2mm x 1.4mm | XO (Standard) | e3 | Matte Tin (Sn) | YES | ±50ppm | 156.25MHz | LVDS | 0.4ns | 0.4ns | 55/45% | Enable/Disable | 2.375V~3.63V | 90mA | Crystal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1123CI5-100.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tube | DSC1123 | Active | 1 (Unlimited) | ROHS3 Compliant | 6-SMD, No Lead | 100MHz | 889μm | Surface Mount | -40°C~85°C | 0.126Lx0.098W 3.20mmx2.50mm | 32mA | 0.035 0.90mm | 3.2mm x 2.5mm x 0.85mm | XO (Standard) | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | ±10ppm | 100MHz | LVDS | 52/48% | Enable/Disable | 2.25V~3.63V | MEMS | 22mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1103CI2-106.2500 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tube | DSC1103 | Active | 1 (Unlimited) | ROHS3 Compliant | 6-SMD, No Lead | 106MHz | Surface Mount | -40°C~85°C | 0.126Lx0.098W 3.20mmx2.50mm | 0.035 0.90mm | 3.2mm x 2.5mm x 0.85mm | XO (Standard) | YES | ±25ppm | 106.25MHz | LVDS | 52/48% | Standby (Power Down) | 2.25V~3.63V | 95μA | MEMS | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1123CE1-156.2500 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tube | DSC1123 | yes | Active | 1 (Unlimited) | Solder | ROHS3 Compliant | 6-SMD, No Lead | 156.25MHz | 889μm | Surface Mount | -20°C~70°C | 0.126Lx0.098W 3.20mmx2.50mm | 32mA | 0.035 0.90mm | AEC-Q100 | 3.2mm x 2.5mm x 0.85mm | XO (Standard) | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | ±50ppm | 2pF | 156.25MHz | LVDS | 52/48% | Enable/Disable | 2.25V~3.63V | 52 % | MEMS | 22mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC6101CI1A-012.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Bag | DSC61XX | Active | 1 (Unlimited) | ROHS3 Compliant | 4-SMD, No Lead | 12MHz | Surface Mount | -40°C~85°C | 0.126Lx0.098W 3.20mmx2.50mm | 0.035 0.89mm | AEC-Q100 | 3.2mm x 2.5mm x 0.85mm | XO (Standard) | YES | ±50ppm | 12MHz | CMOS | 2.2ns | 2.2ns | 55/45% | Enable/Disable | 1.8V~3.3V | 3mA Typ | MEMS | 80μA Typ | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC6101CI2A-026.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Bag | DSC61XX | Active | 1 (Unlimited) | ROHS3 Compliant | 4-SMD, No Lead | 26MHz | Surface Mount | -40°C~85°C | 0.126Lx0.098W 3.20mmx2.50mm | 0.035 0.89mm | AEC-Q100 | 3.2mm x 2.5mm x 0.85mm | XO (Standard) | YES | ±25ppm | 26MHz | CMOS | 2.2ns | 2.2ns | 55/45% | Enable/Disable | 1.8V~3.3V | 3mA Typ | MEMS | 80μA Typ | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1121CL2-050.0000T | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tube | DSC1121 | Active | 3 (168 Hours) | 105°C | -40°C | 3.2004mm | ROHS3 Compliant | 6-SMD, No Lead | 50MHz | 889μm | 2.4892mm | Surface Mount | -40°C~105°C | 0.126Lx0.098W 3.20mmx2.50mm | 35mA | 0.035 0.90mm | AEC-Q100 | XO (Standard) | ±25ppm | CMOS | Enable/Disable | 2.25V~3.6V | 35mA | MEMS | 22mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1001DL2-090.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 9 Weeks | Surface Mount | Tube | DSC1001 | yes | Active | 1 (Unlimited) | ROHS3 Compliant | 4-SMD, No Lead | 90MHz | 889μm | Surface Mount | -40°C~105°C | 0.098Lx0.079W 2.50mmx2.00mm | 8.7mA | 0.035 0.90mm | AEC-Q100 | 2.5mm x 2.0mm x 0.85mm | XO (Standard) | 3.3V | ±25ppm | 90MHz | CMOS | 2ns | 2ns | 55/45% | Enable/Disable | 1.8V~3.3V | MEMS | 15μA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC6001JE1A-010.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tube | DSC60XX | Active | 1 (Unlimited) | ROHS3 Compliant | 4-SMD, No Lead | 10MHz | Surface Mount | -20°C~70°C | 0.098Lx0.079W 2.50mmx2.00mm | 0.035 0.89mm | AEC-Q100 | 2.5mm x 2.0mm x 0.89mm | XO (Standard) | YES | ±50ppm | 10MHz | CMOS | 2ns | 2ns | 55/45% | Enable/Disable | 1.8V~3.3V | 1.3mA Typ | MEMS | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC6001JI2A-026.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tube | DSC60XX | Active | 1 (Unlimited) | ROHS3 Compliant | 4-SMD, No Lead | 26MHz | Surface Mount | -40°C~85°C | 0.098Lx0.079W 2.50mmx2.00mm | 0.035 0.89mm | AEC-Q100 | 2.5mm x 2.0mm x 0.89mm | XO (Standard) | YES | ±25ppm | 26MHz | CMOS | 2ns | 2ns | 55/45% | Enable/Disable | 1.8V~3.3V | 1.3mA Typ | MEMS | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC6001CI2A-004.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tube | DSC60XX | Active | 1 (Unlimited) | ROHS3 Compliant | 4-SMD, No Lead | 4MHz | Surface Mount | -40°C~85°C | 0.126Lx0.098W 3.20mmx2.50mm | 0.035 0.90mm | AEC-Q100 | 3.2mm x 2.5mm x 0.85mm | XO (Standard) | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | YES | ±25ppm | 4MHz | CMOS | 2ns | 2ns | 55/45% | Enable/Disable | 1.8V~3.3V | 1.3mA Typ | MEMS | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC6111MI2A-025.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Bag | DSC61XX | Active | 1 (Unlimited) | ROHS3 Compliant | STANDBY; ENABLE/DISABLE FUNCTION; BULK | 4-SMD, No Lead | 25MHz | Surface Mount | -40°C~85°C | 0.079Lx0.063W 2.00mmx1.60mm | 0.035 0.89mm | AEC-Q100 | 2.0mm x 1.6mm x 0.89mm | XO (Standard) | e4 | Gold (Au) - with Nickel (Ni) barrier | YES | ±25ppm | 25MHz | CMOS | 2.2ns | 2.2ns | 55/45% | Standby (Power Down) | 1.8V~3.3V | 3mA Typ | MEMS | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC6001HI2A-048.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Bag | DSC60XX | Active | 1 (Unlimited) | ROHS3 Compliant | 4-SMD, No Lead | 48MHz | Surface Mount | -40°C~85°C | 0.063Lx0.047W 1.60mmx1.20mm | 0.035 0.89mm | AEC-Q100 | 1.6mm x 1.2mm x 0.89mm | XO (Standard) | YES | ±25ppm | 48MHz | CMOS | 2ns | 2ns | 55/45% | Enable/Disable | 1.8V~3.3V | 1.3mA Typ | MEMS | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1001AI2-050.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Standard, Surface Mount | Tube | DSC1001 | yes | Active | 1 (Unlimited) | Solder | 3.3V | ROHS3 Compliant | 4-SMD, No Lead Exposed Pad | 50MHz | 889μm | Surface Mount | -40°C~85°C | 0.276Lx0.197W 7.00mmx5.00mm | 7.2mA | 0.035 0.90mm | AEC-Q100 | 7.0mm x 5.0mm x 0.85mm | XO (Standard) | e3 | Matte Tin (Sn) | 3.3V | ±25ppm | 15pF | 50MHz | CMOS | 2ns | 2ns | 55/45% | Standby (Power Down) | 1.8V~3.3V | 55 % | MEMS | 15μA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC6001HE2A-024.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Bag | DSC60XX | Active | 1 (Unlimited) | ROHS3 Compliant | 4-SMD, No Lead | 24MHz | Surface Mount | -20°C~70°C | 0.063Lx0.047W 1.60mmx1.20mm | 0.035 0.89mm | AEC-Q100 | 1.6mm x 1.2mm x 0.89mm | XO (Standard) | YES | ±25ppm | 24MHz | CMOS | 2ns | 2ns | 55/45% | Enable/Disable | 1.8V~3.3V | 1.3mA Typ | MEMS | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1123CI5-125.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tube | DSC1123 | Active | 1 (Unlimited) | Solder | ROHS3 Compliant | 6-SMD, No Lead | 125MHz | 889μm | Surface Mount | -40°C~85°C | 0.126Lx0.098W 3.20mmx2.50mm | 32mA | 0.035 0.90mm | AEC-Q100 | 3.2mm x 2.5mm x 0.85mm | XO (Standard) | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | ±10ppm | 2pF | 125MHz | LVDS | 52/48% | Enable/Disable | 2.25V~3.63V | 52 % | MEMS | 22mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1124DI1-100.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tube | DSC1124 | Active | 1 (Unlimited) | ROHS3 Compliant | 6-SMD, No Lead | 100MHz | Surface Mount | -40°C~85°C | 0.098Lx0.079W 2.50mmx2.00mm | 0.035 0.90mm | 2.5mm x 2.0mm x 0.9mm | XO (Standard) | e3 | Matte Tin (Sn) | YES | ±50ppm | 100MHz | HCSL | 0.4ns | 52/48% | Enable/Disable | 2.25V~3.6V | 22mA | MEMS | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1101BI5-133.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tube | DSC1101 | yes | Active | 1 (Unlimited) | ROHS3 Compliant | 6-SMD, No Lead | 133MHz | 889μm | Surface Mount | -40°C~85°C | 0.197Lx0.126W 5.00mmx3.20mm | 35mA | 0.035 0.90mm | 5.0mm x 3.2mm x 0.85mm | XO (Standard) | e3 | Matte Tin (Sn) | ±10ppm | 133MHz | CMOS | 2ns | 2ns | 55/45% | Standby (Power Down) | 2.25V~3.6V | MEMS | 95μA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1123DI2-050.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tube | DSC1123 | yes | Active | 1 (Unlimited) | ROHS3 Compliant | 6-SMD, No Lead | 50MHz | 889μm | Surface Mount | -40°C~85°C | 0.098Lx0.079W 2.50mmx2.00mm | 32mA | 0.035 0.90mm | 2.5mm x 2.0mm x 0.9mm | XO (Standard) | ±25ppm | 50MHz | LVDS | 52/48% | Enable/Disable | 2.25V~3.63V | MEMS | 22mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1103CI1-075.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tube | DSC1103 | yes | Active | 1 (Unlimited) | Solder | ROHS3 Compliant | 6-SMD, No Lead | 75MHz | 889μm | Surface Mount | -40°C~85°C | 0.126Lx0.098W 3.20mmx2.50mm | 32mA | 0.035 0.90mm | AEC-Q100 | 3.2mm x 2.5mm x 0.9mm | XO (Standard) | ±50ppm | 2pF | 75MHz | LVDS | 52/48% | Standby (Power Down) | 2.25V~3.63V | 52 % | MEMS | 95μA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1103BI2-148.5000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tube | DSC1103 | yes | Active | 1 (Unlimited) | ROHS3 Compliant | 6-SMD, No Lead | 148.5MHz | 889μm | Surface Mount | -40°C~85°C | 0.197Lx0.126W 5.00mmx3.20mm | 32mA | 0.035 0.90mm | 5.0mm x 3.2mm x 0.85mm | XO (Standard) | ±25ppm | 148.5MHz | LVDS | 52/48% | Standby (Power Down) | 2.25V~3.63V | MEMS | 95μA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1123AI2-125.0000 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Standard, Surface Mount | Tube | DSC1123 | Active | 1 (Unlimited) | Solder | ROHS3 Compliant | 6-SMD, No Lead Exposed Pad | 125MHz | 889μm | Surface Mount | -40°C~85°C | 0.276Lx0.197W 7.00mmx5.00mm | 32mA | 0.035 0.90mm | AEC-Q100 | 7.0mm x 5.0mm x 0.85mm | XO (Standard) | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | ±25ppm | 2pF | 125MHz | LVDS | 52/48% | Enable/Disable | 2.25V~3.63V | 52 % | MEMS | 22mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCP2515T-E/SO | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 7 Weeks | Surface Mount | Tape & Reel (TR) | 2007 | yes | Active | 1 (Unlimited) | 18 | EAR99 | 5V | ROHS3 Compliant | Lead Free | No | 18 | 18-SOIC (0.295, 7.50mm Width) | SPI | 7.5mm | -40°C~125°C | CMOS | 10mA | 2.65mm | 10mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 5V | 40 | MCP2515 | 5V | 1 Mbps | Controller | 2.7V~5.5V | CANbus | CAN 2.0 | 1 | NO | YES | 40MHz | 1 | NRZ | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCP2221-I/ST | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tube | 2008 | Active | 1 (Unlimited) | 14 | EAR99 | 1 | 5.1mm | ROHS3 Compliant | Tin | 14 | 14-TSSOP (0.173, 4.40mm Width) | I2C, UART | No SVHC | 1.05mm | 4.5mm | 140.30179mg | -40°C~85°C | CMOS | 13mA | 15mA | e3 | DUAL | GULL WING | 260 | 3.3V | 40 | MCP2221 | 0.65mm | Serial IO/Communication Controllers | Not Qualified | 3.3/5V | 12 Mbps | Yes | Bridge, USB to I2C/UART | 3V~5.5V | USB | USB 2.0 | MICROPROCESSOR CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| USB2504A-JT | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 22 Weeks | Surface Mount | Tray | 2002 | Active | 3 (168 Hours) | 70°C | 0°C | 3.3V | 4 | 10.2mm | ROHS3 Compliant | Lead Free | Tin | No | 64 | 64-LQFP | USB | 3.6V | No SVHC | 3V | 1.45mm | 10.2mm | 0°C~70°C | 100mA | 100mA | USB2504 | 480 Mbps | 64-TQFP (10x10) | 3.3V | Hub Controller | USB 2.0 | 3V~3.6V | USB | USB 2.0 | 3 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| USB2512B-I/M2 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 7 Weeks | Tray | 2017 | yes | Active | 3 (168 Hours) | 36 | 6mm | ROHS3 Compliant | 36 | 36-VFQFN Exposed Pad | 6mm | -40°C~85°C | CMOS | 60mA | 1mm | e3 | Matte Tin (Sn) - annealed | QUAD | NO LEAD | 3.3V | USB2512B | YES | 0.5mm | Hub Controller | 3V~3.6V | USB | USB 2.0 | I2C; SMBUS | BUS CONTROLLER, UNIVERSAL SERIAL BUS | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCP2515-E/SO | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 7 Weeks | Surface Mount | Tube | 2003 | yes | Active | 1 (Unlimited) | 18 | EAR99 | 5V | 11.53mm | ROHS3 Compliant | Lead Free | No | 18 | 18-SOIC (0.295, 7.50mm Width) | SPI | No SVHC | 2.31mm | 7.49mm | -40°C~125°C | CMOS | 10mA | 10mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 5V | 40 | MCP2515 | 5V | 1 Mbps | Controller | 2.7V~5.5V | CANbus | CAN 2.0 | 1 | NO | YES | 40MHz | 1 | NRZ | 3 | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||
| LAN9500A-ABZJ | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Surface Mount | Tray | 2009 | Active | 3 (168 Hours) | 56 | 3.3V | 8.15mm | ROHS3 Compliant | Lead Free | Tin | No | 56 | 56-VFQFN Exposed Pad | USB | No SVHC | 900μm | 8.15mm | 0°C~70°C | CMOS | 103mA | e3 | QUAD | 260 | 3.3V | 40 | LAN9500A | 0.5mm | 618mW | 100 Mbps | Bridge, USB to Ethernet | 1.2V 2.5V 3.3V | Ethernet | USB 2.0, 10/100 Base-T/TX PHY | 1 | YES | YES | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 60 MBps | 25MHz | 4 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| KSZ8873MLLI | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Surface Mount | Tray | 2009 | Active | 3 (168 Hours) | 64 | EAR99 | 3.3V | 3 | 10mm | ROHS3 Compliant | Lead Free | 64 | 64-LQFP | I2C, SPI | No SVHC | 10mm | -40°C~85°C | 115mA | 115mA | 1.6mm | 88mA | QUAD | GULL WING | 260 | 1.8V | 30 | KSZ8873 | 0.5mm | Not Qualified | 100 Mbps | Switch | 1.8V 2.5V 3.3V | Ethernet | 10/100 Base-T/TX PHY | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| KSZ8864CNXIA | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 18 Weeks | Tray | Active | 3 (168 Hours) | 64 | 8mm | ROHS3 Compliant | Lead Free | 64-VFQFN Exposed Pad | MII, RMII | 8mm | -40°C~85°C | CMOS | 0.9mm | 8542.39.00.01 | e3 | Matte Tin (Sn) - annealed | QUAD | NO LEAD | NOT SPECIFIED | 1.2V | NOT SPECIFIED | KSZ8864 | YES | 0.4mm | S-XQCC-N64 | 100 Mbps | Switch | 1.8V 2.5V 3.3V | Ethernet | 10/100 Base-T/TX PHY |