Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Operating Supply Voltage | Length | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | REACH SVHC | Reach Compliance Code | Frequency | Height | Width | Mounting Type | Operating Temperature | Size / Dimension | Max Supply Current | Input Type | Height Seated (Max) | Ratings | HTS Code | Packing Method | Number of Functions | Physical Dimension | Nominal Supply Current | Type | Max Input Voltage | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Number of Channels | Qualification Status | Supply Voltage-Max (Vsup) | Max Power Dissipation | Mounting Feature | JEDEC-95 Code | Number of Outputs | Number of Circuits | Data Rate | Applications | Element Configuration | Frequency Stability | Load Capacitance | Operating Frequency | Power Dissipation | Output | Propagation Delay | Turn On Delay Time | Core Architecture | Input | Max Collector Current | Collector Emitter Breakdown Voltage | Collector Emitter Voltage (VCEO) | Rise Time-Max | Fall Time-Max | Symmetry-Max | Frequency Adjustment-Mechanical | Propagation Delay (tpd) | Quiescent Current | Frequency (Max) | Vce(on) (Max) @ Vge, Ic | Continuous Collector Current | Screening Level | Current - Collector Pulsed (Icm) | Td (on/off) @ 25°C | Memory Type | Function | Core Processor | Number of I/O | Telecom IC Type | Voltage - Supply | Power Supply Current-Max (ICC) | Same Edge Skew-Max (tskwd) | fmax-Min | Max Duty Cycle | Current - Supply (Max) | Programmable Type | Duty Cycle | Ratio - Input:Output | Differential - Input:Output | Program Memory Type | Controller Series | Base Resonator | Current - Supply (Disable) (Max) | Frequency - Output 1 | Frequency - Output 2 | Frequency - Output 3 | Available Frequency Range |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
SY58013UMG | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Surface Mount | Tube | 2011 | Precision Edge® | Active | 2 (1 Year) | 16 | 3mm | ROHS3 Compliant | Lead Free | 16 | CAN ALSO OPERATE WITH 3.3V SUPPLY | 16-VFQFN Exposed Pad, 16-MLF® | 3mm | Surface Mount | -40°C~85°C | 0.95mm | 1 | Fanout Buffer (Distribution), Translator | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | NO LEAD | 260 | 2.5V | 40 | SY58013 | 0.5mm | 2 | Not Qualified | 3.6V | 4 | 1 | 10 Gbps | LVPECL | 250 ps | CML, LVDS, LVPECL | 6GHz | 2.375V~3.6V | 6000 MHz | 1:2 | Yes/Yes | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SY89218UHY | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 6 Weeks | Surface Mount | Tray | 2000 | Precision Edge® | Active | 3 (168 Hours) | 64 | 2.5V | ROHS3 Compliant | Lead Free | 64 | 64-TQFP Exposed Pad | Surface Mount | -40°C~85°C | 1 | Fanout Buffer (Distribution), Divider, Multiplexer | 2.5V | e3 | MATTE TIN | QUAD | GULL WING | 260 | 2.5V | 40 | SY89218 | 0.5mm | 2.375V | Not Qualified | 2.625V | 1 | LVDS | CML, LVDS, PECL | 2GHz | 2.375V~2.625V | 2000 MHz | 2:15 | Yes/Yes | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SY89467UHY | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 9 Weeks | Surface Mount | Tray | 2008 | Precision Edge® | Active | 3 (168 Hours) | 64 | ROHS3 Compliant | Lead Free | No | 64 | IT CAN ALSO OPERATES WITH 3V TO 3.6V SUPPLY | 64-TQFP Exposed Pad | Surface Mount | -40°C~85°C | 1 | Fanout Buffer (Distribution), Multiplexer | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 2.5V | 40 | SY89467 | 0.5mm | 2.375V | 2.625V | 20 | 1 | LVPECL | 1.2 ns | CML, LVDS, PECL | 2GHz | 2.375V~3.6V | 0.3 ns | 55 % | 2:20 | Yes/Yes | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SY89874AUMG | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 9 Weeks | Surface Mount | Tube | Precision Edge® | Active | 2 (1 Year) | 16 | 3mm | ROHS3 Compliant | 16-VFQFN Exposed Pad | 3mm | Surface Mount | -40°C~85°C | 0.9mm | 1 | Fanout Buffer (Distribution), Divider, Multiplexer | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | NO LEAD | 260 | 2.5V | 40 | SY89874 | 0.5mm | 2.375V | 3.63V | 1 | LVPECL | CML, HSTL, LVCMOS, LVDS, LVTTL, PECL | 0.7 ns | 2.5GHz | 2.375V~3.63V | 2500 MHz | 1:2 | Yes/Yes | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SY89872UMG | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Surface Mount | Tube | 2007 | Precision Edge® | Active | 2 (1 Year) | 16 | 2.5V | 3mm | ROHS3 Compliant | Lead Free | No | 16 | CAN ALSO OPERATE WITH 3.3V SUPPLY | 16-VFQFN Exposed Pad, 16-MLF® | No SVHC | 3.2GHz | 3mm | Surface Mount | -40°C~85°C | 0.95mm | 1 | 75mA | Fanout Buffer (Distribution), Divider | 6V | e3 | Matte Tin (Sn) | QUAD | 260 | 2.5V | 40 | SY89872 | 0.5mm | 2.375V | 6 | 1 | LVDS | 750 ps | 750 ps | CML, HSTL, LVDS, LVPECL | 110mA | 2GHz | 2.375V~2.625V | 2000 MHz | 1:3 | Yes/Yes | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SY58607UMG-TR | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tape & Reel (TR) | 2000 | Precision Edge® | Active | 2 (1 Year) | 16 | 3mm | ROHS3 Compliant | Lead Free | No | 16 | CAN ALSO OPERATE WITH 3.3V SUPPLY; SEATED HT-CALCULATED | 16-VFQFN Exposed Pad, 16-MLF® | 3mm | Surface Mount | -40°C~85°C | 0.95mm | TR | 1 | Fanout Buffer (Distribution) | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | 2.5V | SY58607 | 0.5mm | 2 | 1 | LVPECL | 450 ps | 450 ps | CML, LVDS, LVPECL | 3GHz | 2.375V~3.6V | 60mA | 53 % | 1:2 | Yes/Yes | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SY89202UMG-TR | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 8 Weeks | Surface Mount | Tape & Reel (TR) | Precision Edge® | Active | 3 (168 Hours) | 32 | 5mm | ROHS3 Compliant | Lead Free | No | 32 | ALSO OPERATES AT 3.3V SUPPLY | 32-VFQFN Exposed Pad, 32-MLF® | 5mm | Surface Mount | -40°C~85°C | 0.9mm | 1 | Fanout Buffer (Distribution), Divider, Multiplexer | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | 260 | 2.5V | 40 | SY89202 | 0.5mm | 2.375V | 2.625V | 8 | 1 | LVPECL | CML, LVDS, PECL | 0.93 ns | 1.5GHz | 2.375V~3.6V | 0.05 ns | 1:8 | Yes/Yes | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
GN2470K4-G | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 14 Weeks | Surface Mount | Tape & Reel (TR) | 2008 | Active | 3 (168 Hours) | 2 | EAR99 | 6.73mm | ROHS3 Compliant | No | 3 | TO-252-3, DPak (2 Leads + Tab), SC-63 | 2.39mm | 6.1mm | Surface Mount | -55°C~150°C TJ | Standard | GULL WING | 260 | R-PSSO-G2 | 2.5W | TO-252AA | Single | 2.5W | 1A | 700V | 700V | 5V @ 13V, 3A | 1A | 3.5A | 8ns/20ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC8122BI2 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Surface Mount | Tube | DSC8122 | Active | 1 (Unlimited) | Solder | 3.3V | ROHS3 Compliant | 4 | 6-SMD, No Lead | 460MHz | 889μm | Surface Mount | -40°C~85°C | 0.197Lx0.126W 5.00mmx3.20mm | 58mA | 0.035 0.90mm | AEC-Q100 | 5.0mm x 3.2mm x 0.85mm | XO (Standard) | 25 ppm | 10MHz | LVPECL | 0.25ns | 0.25ns | Enable/Disable | 2.25V~3.6V | 52 % | Blank (User Must Program) | MEMS | 10MHz~460MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC8103BI2T | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 4 Weeks | Surface Mount | Tape & Reel (TR) | 2013 | DSC8103 | Active | 3 (168 Hours) | Solder | ROHS3 Compliant | 6-SMD, No Lead | 460MHz | 889μm | Surface Mount | -40°C~85°C | 0.197Lx0.126W 5.00mmx3.20mm | 32mA | 0.035 0.90mm | AEC-Q100 | 5.0mm x 3.2mm x 0.85mm | XO (Standard) | ±25ppm | 2pF | LVDS | 0.2ns | 0.2ns | 52/48% | Standby | 2.25V~3.6V | 52 % | Blank (User Must Program) | MEMS | 95μA | 10MHz~460MHz | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC8102BI2T | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | Surface Mount | Tape & Reel (TR) | 2013 | DSC8102 | Active | 3 (168 Hours) | ROHS3 Compliant | 6-SMD, No Lead | 889μm | Surface Mount | -40°C~85°C | 0.197Lx0.126W 5.00mmx3.20mm | 58mA | 0.035 0.90mm | AEC-Q100 | 5.0mm x 3.2mm x 0.85mm | XO (Standard) | ±25ppm | 10MHz | LVPECL | 0.25ns | 0.25ns | 52/48% | NO | Standby | 2.25V~3.6V | Blank (User Must Program) | MEMS | 95μA | 10MHz~460MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC8001BL5T | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 4 Weeks | Surface Mount | Tape & Reel (TR) | 2009 | DSC8001 | Active | 3 (168 Hours) | Solder | 3.3V | ROHS3 Compliant | 4-SMD, No Lead | 150MHz | 889μm | Surface Mount | -40°C~105°C | 0.197Lx0.126W 5.00mmx3.20mm | 12.2mA | 0.035 0.90mm | AEC-Q100 | 5.0mm x 3.2mm x 0.85mm | XO (Standard) | 1.8V | ±10ppm | 15pF | CMOS | 3ns | 3ns | 55/45% | Standby | 1.8V~3.3V | 55 % | Blank (User Must Program) | MEMS | 15μA | 1MHz~150MHz | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
KSZ8692PBI | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 8 Weeks | Surface Mount | Tray | 2011 | KSZx692 | Active | 3 (168 Hours) | 400 | 1.365V | 27mm | ROHS3 Compliant | Lead Free | No | 400 | 400-BGA | EBI/EMI, Ethernet, I2C, I2S,PCI, SPI, UART/USART, USB | 27mm | Surface Mount | -40°C~85°C | 2.33mm | 8542.39.00.01 | 1 | e1 | TIN SILVER COPPER | BOTTOM | BALL | 250 | 1.3V | 40 | KSZ8692 | 1.27mm | Networking and Communications | ARM | External Program Memory | ARM9® | 20 | SUPPORT CIRCUIT | 1.235V~1.365V | External Program Memory | KSZ | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC6023HI2A-00A8 | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | Bag | DSC60XX | Active | 1 (Unlimited) | ROHS3 Compliant | 4-VFLGA | 0.035 0.89mm | -40°C~85°C | 0.063Lx0.047W 1.60mmx1.20mm | 1.6mm x 1.2mm x 0.89mm | XO (Standard) | YES | SURFACE MOUNT | ±25ppm | CMOS | 3.5ns | 3.5ns | 55/45% | NO | 1.71V~3.63V | 1.3mA Typ | MEMS | 25MHz 27MHz | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC6121HI2A-00AR | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | Bag | DSC61XX | Active | 1 (Unlimited) | ROHS3 Compliant | AEC-Q100; BULK | 4-VFLGA | 0.035 0.89mm | -40°C~85°C | 0.063Lx0.047W 1.60mmx1.20mm | 1.6mm x 1.2mm x 0.89mm | XO (Standard) | YES | SURFACE MOUNT | ±25ppm | CMOS | 2.2ns | 2.2ns | 55/45% | NO | 1.71V~3.63V | 3mA Typ | MEMS | 24MHz 48MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC6023HI2A-00AA | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | Bag | DSC60XX | Active | 1 (Unlimited) | ROHS3 Compliant | 4-VFLGA | 0.035 0.89mm | -40°C~85°C | 0.063Lx0.047W 1.60mmx1.20mm | 1.6mm x 1.2mm x 0.89mm | XO (Standard) | YES | SURFACE MOUNT | ±25ppm | CMOS | 3.5ns | 3.5ns | 55/45% | NO | 1.71V~3.63V | 1.3mA Typ | MEMS | 19.44MHz 25MHz | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC612RI3A-010J | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Bulk | DSC612 | Active | 1 (Unlimited) | ROHS3 Compliant | 6-VFLGA | 0.035 0.89mm | -40°C~85°C | 0.098Lx0.079W 2.50mmx2.00mm | XO (Standard) | ±20ppm | LVCMOS | Enable/Disable | 1.71V~3.63V | 6mA | MEMS | 1.5μA | 24MHz | 32.768kHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC6121HI2A-00AQ | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | Bag | DSC61XX | Active | 1 (Unlimited) | ROHS3 Compliant | AEC-Q100; BULK | 4-VFLGA | 0.035 0.89mm | -40°C~85°C | 0.063Lx0.047W 1.60mmx1.20mm | 1.6mm x 1.2mm x 0.89mm | XO (Standard) | YES | SURFACE MOUNT | ±25ppm | CMOS | 2.2ns | 2.2ns | 55/45% | NO | 1.71V~3.63V | 3mA Typ | MEMS | 12MHz 24MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC6121HI2A-00AMT | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | Tape & Reel (TR) | DSC61XX | Active | 1 (Unlimited) | ROHS3 Compliant | AEC-Q100; TR | 4-VFLGA | 0.035 0.89mm | -40°C~85°C | 0.063Lx0.047W 1.60mmx1.20mm | 1.6mm x 1.2mm x 0.89mm | XO (Standard) | YES | SURFACE MOUNT | ±25ppm | CMOS | 2.2ns | 2.2ns | 55/45% | NO | 1.71V~3.63V | 3mA Typ | MEMS | 26MHz 27MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC6121HI2A-00AP | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | Bag | DSC61XX | Active | 1 (Unlimited) | ROHS3 Compliant | AEC-Q100; BULK | 4-VFLGA | 0.035 0.89mm | -40°C~85°C | 0.063Lx0.047W 1.60mmx1.20mm | 1.6mm x 1.2mm x 0.89mm | XO (Standard) | YES | SURFACE MOUNT | ±25ppm | CMOS | 2.2ns | 2.2ns | 55/45% | NO | 1.71V~3.63V | 3mA Typ | MEMS | 19.44MHz 25MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC6021CI2A-00GB | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Bulk | DSC60XX | Active | 1 (Unlimited) | RoHS Compliant | 4-VDFN | compliant | 0.035 0.90mm | -40°C~85°C | 0.126Lx0.098W 3.20mmx2.50mm | MEMS (Silicon) | ±25ppm | CMOS | 1.71V~3.63V | 1.3mA Typ | MEMS | 27.705MHz 27.71MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC612RI2A-012P | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tube | DSC612 | Active | 1 (Unlimited) | 6 | 2.5mm | RoHS Compliant | 6-VFLGA | compliant | 0.035 0.89mm | 2mm | -40°C~85°C | 0.098Lx0.079W 2.50mmx2.00mm | MEMS (Silicon) | BOTTOM | NO LEAD | 1.8V | YES | 0.825mm | R-PBGA-N6 | ±25ppm | LVCMOS | TS 16949 | 1.71V~3.63V | 6mA | MEMS | 5.5296MHz | 10MHz | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC6121HI2A-00AH | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | Bag | DSC61XX | Active | 1 (Unlimited) | ROHS3 Compliant | AEC-Q100; BULK | 4-VFLGA | 0.035 0.89mm | -40°C~85°C | 0.063Lx0.047W 1.60mmx1.20mm | 1.6mm x 1.2mm x 0.89mm | XO (Standard) | YES | SURFACE MOUNT | ±25ppm | CMOS | 2.2ns | 2.2ns | 55/45% | NO | 1.71V~3.63V | 3mA Typ | MEMS | 50MHz 100MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC6023HI2A-00AD | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | Bag | DSC60XX | Active | 1 (Unlimited) | ROHS3 Compliant | 4-VFLGA | 0.035 0.89mm | -40°C~85°C | 0.063Lx0.047W 1.60mmx1.20mm | 1.6mm x 1.2mm x 0.89mm | XO (Standard) | YES | SURFACE MOUNT | ±25ppm | CMOS | 3.5ns | 3.5ns | 55/45% | NO | 1.71V~3.63V | 1.3mA Typ | MEMS | 6.1298MHz 6.1679MHz | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC613RI2A-012ST | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tape & Reel (TR) | DSC613 | Active | 1 (Unlimited) | 6 | 2.5mm | RoHS Compliant | 6-VFLGA | compliant | 0.035 0.89mm | 2mm | -40°C~85°C | 0.098Lx0.079W 2.50mmx2.00mm | XO (Standard) | BOTTOM | NO LEAD | 1.8V | YES | 0.825mm | R-PBGA-N6 | ±25ppm | LVCMOS | TS 16949 | 1.71V~3.63V | 6.5mA | MEMS | 12MHz | 25MHz | 32.768kHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC613RI3A-010U | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tube | DSC613 | Active | 1 (Unlimited) | 6 | 2.5mm | ROHS3 Compliant | 6-VFLGA | 0.035 0.89mm | 2mm | -40°C~85°C | 0.098Lx0.079W 2.50mmx2.00mm | XO (Standard) | BOTTOM | NO LEAD | 1.8V | YES | 0.825mm | R-PBGA-N6 | ±20ppm | LVCMOS | TS 16949 | Enable/Disable | 1.71V~3.63V | 6.5mA | MEMS | 1.5μA | 50MHz | 25MHz | 27MHz | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC6021CI2A-00A1T | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | Tape & Reel (TR) | DSC60XX | Active | 1 (Unlimited) | ROHS3 Compliant | AEC-Q100; TR | 4-VDFN | 0.035 0.90mm | -40°C~85°C | 0.126Lx0.098W 3.20mmx2.50mm | 3.2mm x 2.5mm x 0.85mm | XO (Standard) | YES | SURFACE MOUNT | ±25ppm | CMOS | 2ns | 2ns | 55/45% | NO | 1.71V~3.63V | 1.3mA Typ | MEMS | 12MHz 24MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC6122CI2A-00AVT | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | Tape & Reel (TR) | DSC61XX | Active | 1 (Unlimited) | ROHS3 Compliant | AEC-Q100; TR | 4-VDFN | 0.035 0.90mm | -40°C~85°C | 0.126Lx0.098W 3.20mmx2.50mm | 3.2mm x 2.5mm x 0.85mm | XO (Standard) | YES | SURFACE MOUNT | ±25ppm | CMOS | 1.5ns | 1.5ns | 55/45% | NO | 1.71V~3.63V | 3mA Typ | MEMS | 74.1758MHz 74.25MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC6021CI2A-009S | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | Tube | DSC60XX | Active | 1 (Unlimited) | ROHS3 Compliant | AEC-Q100; BAG | 4-VDFN | 0.035 0.90mm | -40°C~85°C | 0.126Lx0.098W 3.20mmx2.50mm | 3.2mm x 2.5mm x 0.85mm | XO (Standard) | YES | SURFACE MOUNT | ±25ppm | CMOS | 2ns | 2ns | 55/45% | NO | 1.71V~3.63V | 1.3mA Typ | MEMS | 20MHz 25MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
DSC6122CI2A-00B3T | Microchip Technology | $0.00 |
Min: 1 Mult: 1 |
download | Tape & Reel (TR) | DSC61XX | Active | 1 (Unlimited) | ROHS3 Compliant | AEC-Q100; TR | 4-VDFN | 0.035 0.90mm | -40°C~85°C | 0.126Lx0.098W 3.20mmx2.50mm | 3.2mm x 2.5mm x 0.85mm | XO (Standard) | YES | SURFACE MOUNT | ±25ppm | CMOS | 1.5ns | 1.5ns | 55/45% | NO | 1.71V~3.63V | 3mA Typ | MEMS | 6.1298MHz 6.1679MHz |
Products