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XAZU3EG-L1SFVC784I

784 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 128 I/O0.72V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XAZU3EG-L1SFVC784I
  • Package: 784-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 971
  • Description: 784 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 128 I/O0.72V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 784-BFBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 784
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B784
Number of I/O 128
Speed 500MHz, 1.2GHz
RAM Size 1.8MB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, I2C, SPI, UART/USART, USB
Architecture MPU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Height Seated (Max) 3.32mm
Length 23mm
Width 23mm
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC is built.This system on a chip is packaged as 784-BFBGA, FCBGA by the manufacturer.A SoC chip with 1.8MB RAM is provided for users to enjoy reliable performance.A MPU, FPGA technique is used for the SoC design's internal architecture.The Zynq? UltraScale+? MPSoC EG series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.There is one thing to note about this SoC security: it combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.This SoC part has a total of 128 I/Os.A 0.72V power supply should be used.In total, there are 784 terminations, which makes system on a chip possible.MICROPROCESSOR CIRCUIT served as its uPs, uCs, and peripheral integrated circuits.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


1.8MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.


XAZU3EG-L1SFVC784I System On Chip (SoC) applications.

  • Mobile market
  • Networked sensors
  • PC peripherals
  • Temperature Sensors
  • High-end PLC
  • Video Imaging
  • Automotive
  • AC drive control module
  • Industrial automation devices
  • Mouse