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  • M2S100TS-1FC1152I

M2S100TS-1FC1152I

-40°C~100°C TJ M2S100TS System On ChipSmartFusion?2 Series 574 I/O


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S100TS-1FC1152I
  • Package: 1152-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 127
  • Description: -40°C~100°C TJ M2S100TS System On ChipSmartFusion?2 Series 574 I/O(Kg)

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Details

Tags

Parameters
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FCBGA (35x35)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®2
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Frequency 166MHz
Base Part Number M2S100TS
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 574
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Core Architecture ARM
Primary Attributes FPGA - 100K Logic Modules
Flash Size 512KB
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.There is a 1152-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.Internally, this SoC design uses the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?2.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.This SoC security combines FPGA - 100K Logic Modules and that is something to note.It comes in a state-of-the-art Tray package.As a whole, this SoC part is comprised of 574 inputs and outputs.The flash is set to 512KB.Searching M2S100TS will yield system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 166MHz.Core architecture of ARM underpins the SoC meaning.Just -40°C is needed to get the SoC computing up and running.As designed, this SoC system on chip can operate at a maximum temperature of 100°C.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S100TS-1FC1152I System On Chip (SoC) applications.

  • Automotive
  • Networked sensors
  • Test and Measurement
  • Smartphones
  • ARM
  • AC-input BLDC motor drive
  • CNC control
  • Digital Media
  • ARM processors
  • Published Paper