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M2S100-1FCG1152

0°C~85°C TJ M2S100 System On ChipSmartFusion?2 Series 574 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S100-1FCG1152
  • Package: 1152-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 934
  • Description: 0°C~85°C TJ M2S100 System On ChipSmartFusion?2 Series 574 I/O1.2V (Kg)

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Details

Tags

Parameters
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series SmartFusion®2
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number M2S100
JESD-30 Code S-PBGA-B1152
Number of Outputs 574
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 574
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 574
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes FPGA - 100K Logic Modules
Number of Logic Cells 99512
Flash Size 512KB
Height Seated (Max) 2.9mm
Length 35mm
Width 35mm
RoHS Status RoHS Compliant
Package / Case 1152-BBGA, FCBGA
Surface Mount YES

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is embedded in this SoC.Its package is 1152-BBGA, FCBGA.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Featured system on chip SoCs of the SmartFusion?2 series.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.A key point to note is that this SoC security combines FPGA - 100K Logic Modules.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.As a whole, this SoC part includes 574 I/Os.Ideally, a power supply with a voltage of 1.2V should be used.It is unsafe to operate the SoCs wireless at voltages above 1.26V.At least 1.14V can be supplied as a power source.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.A SoC chip with 574 outputs is available.In order to operate system on chip, you will need 1.2V power supplies.The SoC chip offers 574 inputs.System on chips of logic are comprised of 99512 logic cells.The flash size of the SoC meaning is 512KB.M2S100 will give you system on chips with similar specifications and purposes.The wireless SoC works at a frequency of 166MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S100-1FCG1152 System On Chip (SoC) applications.

  • Self-aware system-on-chip (SoC)
  • DC-input BLDC motor drive
  • Vending machines
  • CNC control
  • Multiprocessor system-on-chips (MPSoCs)
  • Industrial automation devices
  • Medical
  • Smartphones
  • Smart appliances
  • Functional safety for critical applications in the aerospace