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Thermal Management

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Part Number
Manufacturers
Desc
In Stock
Packing
Rfq
Rochester Electronics, LLC
16-SSOP (0.154, 3.90mm Width) Thermal Management
321
16-SSOP (0.154, 3.90mm Width)
Rochester Electronics, LLC
16-SSOP (0.154, 3.90mm Width) Thermal Management
504
16-SSOP (0.154, 3.90mm Width)
Rochester Electronics, LLC
16-SSOP (0.154, 3.90mm Width) Thermal Management
394
16-SSOP (0.154, 3.90mm Width)
ON Semiconductor
32-VFQFN Exposed Pad, CSP Thermal Management 3.3V VLead Free
995
32-VFQFN Exposed Pad, CSP
Rochester Electronics, LLC
16-SSOP (0.154, 3.90mm Width) Thermal Management
454
16-SSOP (0.154, 3.90mm Width)
Rochester Electronics, LLC
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Thermal Management
568
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
Rochester Electronics, LLC
Thermal Management 4.9022mm mm
590
-
Rochester Electronics, LLC
16-SSOP (0.154, 3.90mm Width) Thermal Management
411
16-SSOP (0.154, 3.90mm Width)
Microchip Technology
8-VFDFN Exposed Pad Thermal Management
594
8-VFDFN Exposed Pad
Maxim Integrated
24-TSSOP (0.173, 4.40mm Width) Thermal Management 7.8mm mmLead Free
747
24-TSSOP (0.173, 4.40mm Width)
Rochester Electronics, LLC
16-SSOP (0.154, 3.90mm Width) Thermal Management
220
16-SSOP (0.154, 3.90mm Width)
Rochester Electronics, LLC
Thermal Management 4.9mm mm
675
-
Texas Instruments
16-SSOP (0.154, 3.90mm Width) Thermal Management 4.9mm mmContains Lead
636
16-SSOP (0.154, 3.90mm Width)
ON Semiconductor
24-SSOP (0.154, 3.90mm Width) Thermal Management 8.65mm mmLead Free
672
24-SSOP (0.154, 3.90mm Width)
ON Semiconductor
24-SSOP (0.154, 3.90mm Width) Thermal Management 8.65mm mmLead Free
709
24-SSOP (0.154, 3.90mm Width)
Texas Instruments
24-TSSOP (0.173, 4.40mm Width) Thermal Management 3.3V V7.8mm mmLead Free
723
24-TSSOP (0.173, 4.40mm Width)
Texas Instruments
24-TSSOP (0.173, 4.40mm Width) Thermal Management 7.8mm mmLead Free
976
24-TSSOP (0.173, 4.40mm Width)
Linear Technology/Analog Devices
16-TFSOP (0.118, 3.00mm Width) Thermal Management 4.039mm mm
410
16-TFSOP (0.118, 3.00mm Width)
NXP USA Inc.
8-WFDFN Exposed Pad Thermal Management
427
8-WFDFN Exposed Pad
Analog Devices Inc.
14-CDIP (0.300, 7.62mm) Thermal Management 5V V17.78mm mmContains Lead
462
14-CDIP (0.300, 7.62mm)
NXP USA Inc.
8-WFDFN Exposed Pad Thermal Management
404
8-WFDFN Exposed Pad
Linear Technology/Analog Devices
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Thermal Management 3mm mm
532
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
Linear Technology/Analog Devices
48-LQFP Thermal Management
137
48-LQFP
Maxim Integrated
8-SOIC (0.154, 3.90mm Width) Thermal Management 4.9mm mmLead Free
394
8-SOIC (0.154, 3.90mm Width)
Texas Instruments
24-TSSOP (0.173, 4.40mm Width) Thermal Management 7.8mm mmLead Free
468
24-TSSOP (0.173, 4.40mm Width)
Texas Instruments
24-TSSOP (0.173, 4.40mm Width) Thermal Management 7.8mm mmLead Free
429
24-TSSOP (0.173, 4.40mm Width)
Maxim Integrated
16-SSOP (0.154, 3.90mm Width) Thermal Management 5.5V V4.98mm mmLead Free
162
16-SSOP (0.154, 3.90mm Width)
Analog Devices Inc.
TO-100-10 Metal Can Thermal Management 9.4mm mmContains Lead
769
TO-100-10 Metal Can
Linear Technology/Analog Devices
48-LQFP Thermal Management
315
48-LQFP
Maxim Integrated
16-SSOP (0.154, 3.90mm Width) Thermal Management
968
16-SSOP (0.154, 3.90mm Width)