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Part Number
Manufacturers
Desc
In Stock
Packing
Rfq
Microsemi Corporation
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
540
484-BGA
Microsemi Corporation
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
316
325-TFBGA, CSPBGA
Microsemi Corporation
676 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V
525
676-BGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
738
484-BGA
Microsemi Corporation
400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
353
400-LFBGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
346
484-BGA
Microsemi Corporation
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
569
325-TFBGA, CSPBGA
Microsemi Corporation
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
566
325-TFBGA, CSPBGA
Microsemi Corporation
0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O
691
484-BGA
Microsemi Corporation
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
576
325-TFBGA, CSPBGA
Microsemi Corporation
325 Terminations-40°C~100°C TJ 325 Pin System On ChipSmartFusion?2 Series 180 I/O1.2V
777
325-TFBGA, CSPBGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
420
484-BGA
Microsemi Corporation
676 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V
808
676-BGA
Microsemi Corporation
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
901
325-TFBGA, CSPBGA
Microsemi Corporation
0°C~85°C TJ 400 Pin M2S050 System On ChipSmartFusion?2 Series 207 I/O
911
400-LFBGA
Microsemi Corporation
0°C~85°C TJ M2S050 System On ChipSmartFusion?2 Series 377 I/O
285
896-BGA
Microsemi Corporation
400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
443
400-LFBGA
Microsemi Corporation
0°C~85°C TJ M2S050T System On ChipSmartFusion?2 Series 267 I/O
562
484-BGA
Microsemi Corporation
0°C~85°C TJ 400 Pin M2S050 System On ChipSmartFusion?2 Series 207 I/O
975
400-LFBGA
Microsemi Corporation
-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O
613
484-BGA
Microsemi Corporation
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
412
325-TFBGA, CSPBGA
Microsemi Corporation
676 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V
867
676-BGA
Microsemi Corporation
400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
986
400-LFBGA
Microsemi Corporation
484 Terminations0°C~85°C TJ 484 Pin System On ChipSmartFusion?2 Series 267 I/O1.2V
139
484-BGA
Microsemi Corporation
0°C~85°C TJ M2S050 System On ChipSmartFusion?2 Series 267 I/O
482
484-BGA
Microsemi Corporation
400 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
113
400-LFBGA
Microsemi Corporation
676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V
996
676-BGA
Microsemi Corporation
-40°C~100°C TJ 484 Pin M2S050 System On ChipSmartFusion?2 Series 267 I/OMin 1.14V VMax 1.26V V
724
484-BGA
Microsemi Corporation
400 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
294
400-LFBGA
Intel
0°C~85°C TJ 5ASXFB3 System On ChipArria V SX Series MCU - 208, FPGA - 385 I/O1.1V
212
1152-BBGA, FCBGA